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NTZD3154N
Small Signal MOSFET
20 V, 540 mA, Dual N ? Channel
Features
?
?
?
?
?
Low R DS(on) Improving System Efficiency
Low Threshold Voltage
Small Footprint 1.6 x 1.6 mm
ESD Protected Gate
These Devices are Pb ? Free, Halogen Free/BFR Free and are RoHS
Compliant
V (BR)DSS
20
http://onsemi.com
R DS(on) Typ I D Max (Note 1)
400 m W @ 4.5 V
500 m W @ 2.5 V 540 mA
700 m W @ 1.8 V
Applications
? Load/Power Switches
? Power Supply Converter Circuits
? Battery Management
? Cell Phones, Digital Cameras, PDAs, Pagers, etc.
G1
D1
G2
D2
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted.)
Parameter Symbol
Value
Unit
S1
N ? Channel
MOSFET
S2
T A = 85 ° C
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage
Continuous Drain Current
(Note 1)
Power Dissipation
(Note 1)
Continuous Drain Current
(Note 1)
Power Dissipation
(Note 1)
Pulsed Drain Current
Steady T A = 25 ° C
State
Steady State
T A = 25 ° C
t v 5s
T A = 85 ° C
t v 5s
t p = 10 m s
V DSS
V GS
I D
P D
I D
P D
I DM
20
± 6.0
540
390
250
570
410
280
1.5
V
V
mA
mW
mA
mW
A
MARKING
DIAGRAM
6
1 TV M G
SOT ? 563 ? 6 G
CASE 463A
TV = Specific Device Code
M = Date Code
G = Pb ? Free Package
(Note: Microdot may be in either location)
PINOUT: SOT ? 563
Operating Junction and Storage Temperature
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
T J ,
T STG
I S
T L
? 55 to
150
350
260
° C
mA
° C
S 1 1
G 1 2
6 D 1
5 G 2
THERMAL RESISTANCE RATINGS
Parameter
Junction ? to ? Ambient – Steady State
(Note 1)
Junction ? to ? Ambient – t v 5 s (Note 1)
Symbol
R q JA
Max
500
447
Unit
° C/W
D 2
3
Top View
4 S 2
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 in sq pad size
(Cu. area = 1.127 in sq [1 oz] including traces).
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
? Semiconductor Components Industries, LLC, 2013
January, 2013 ? Rev. 2
1
Publication Order Number:
NTZD3154N/D
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